[Ti] Design and/or heat dissipation issues?

[Adam Boettiger]

> I still think the little extendible legs on my Powerbook 3400c were a
> simple and effective way of keeping air flowing around the laptop.

I wasn't into them when the 3400c was made but that seems like a brilliant
idea, fold-in clip legs in the back or something. It doesn't seem to me like
that would be that difficult to do.

On the other hand, having read Trevor's post about a metal box, I just
looked over at my Palm Tungsten-3 in its hard leather case. It's a little
larger and thicker than a deck of cards and I just put it under the back and
it seems to be a sturdy fix (and free).

You mentioned that the cooling issue won't be fixed until they start using
faster chips, which might be ... When?

Or is it possible that by the time they start using faster chips there will
be a newer OSX that uses those faster chips, so the heating issue may always
be a problem?

/AB