Most people make the mistake of gobbing it on. A thin coat is all that is needed and a thick coat can actually hinder heat dissipation. The metal fins is what dissipates the heat not the compound. I've worked on computers for 20+ years professionally with computers that cannot have down time. Steve Adams On Oct 8, 2007, at 1:42 AM, Inga Renault wrote: > My gosh...not easily visible, but mine were compacted with dust. > The sound is still loud, but I wil try and see if blowing out > anything else helps. > > Somebody suggested redoing the heat sink since my MDD 866 had > gotten so loud. I know for a fact that the person who replaced > this processor puts on very little silver compound. If I am going > to take it apart, is that definetly the way to go? On my old B+W > G3s, I used to now worry too much and goobered things on, swapping > the processors without blinking an eye, but on the newer machines, > the heat sinks are so much bigger and I don't know much about them. > Is and extremely thin film the way to go for sure? > > Thanks, > Inga > > > On Oct 7, 2007, at 5:50 AM, Jay E. Krauss Jr wrote: > >> I have two 1.25 MDDs; from experience I can state that the >> shield inside the front cover (behind the "Buick" vents, can >> become totally covered over with dust, preventing air entry. >> Jay E Krauss Jr > > _______________________________________________ > G4 mailing list > G4 at listserver.themacintoshguy.com > http://listserver.themacintoshguy.com/mailman/listinfo/g4 -------------- next part -------------- An HTML attachment was scrubbed... URL: http://listserver.themacintoshguy.com/pipermail/g4/attachments/20071008/beb84b66/attachment-0001.html