[Ti] Design and/or heat dissipation issues?

[Dr. Trevor J. Hutley]

At 12:56 -0600 4/12/04, Chris Olson wrote:
>On Dec 4, 2004, at 12:16 PM, Adam Boettiger wrote:
>
>>I would have thought that by the time the AL books came out they 
>>would have fixed the heat issue.
>
>Exactly how would you propose to "fix" it?  You're dealing with 
>electronic components, all of which create heat, crammed into a very 
>small metal case (that conducts heat very well) that has limited 
>capacity for airflow.

In fact, the adoption of aluminium (best specific heat conducting 
metal) is a design route (material selection) to aid heat 
dissipation.  To use something more sophisticated, like the fluid 
cooling system in the G5s, would be too complex in such a thin 
laptop.  I presume heat generation will be reduced as they move to 
higher resolution chips (130nm down to 90 nm or whatever the current 
target/limit is).  The more compact the construction, the less heat 
output, as I understand it.   Moderate clock speeds also aid in heat 
generation.

I still think the little extendible legs on my Powerbook 3400c were a 
simple and effective way of keeping air flowing around the laptop. 
The Ti Tote&Tilt did the same on my Ti-500.  I use a paperback book 
or a small metal box for my Al-book.  Not so sophisticated. 
Occasionally, an ice pack from the freezer.

regards,  Trevor