[Ti] Design and/or heat dissipation issues?

[Chris Olson]

On Dec 4, 2004, at 12:16 PM, Adam Boettiger wrote:

> I would have thought that by the time the AL books came out they would 
> have fixed the heat issue.

Exactly how would you propose to "fix" it?  You're dealing with 
electronic components, all of which create heat, crammed into a very 
small metal case (that conducts heat very well) that has limited 
capacity for airflow.
--
Chris